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Thesis

The processing, microstructure and creep properties of Pb-free solders for harsh environments

Abstract:

The constitutive mechanical behaviour with a focus on creep of Sn-Pb and various Sn-Ag-Cu based Pb-free solders in the 25-150°C temperature range has been studied using nanoindentation and various new meso-scale tests. All alloys have been studied as bulk wave soldering bars, as-received solder balls and solder joints. Ball Grid Array (BGA) solder joints in a typical electronic configuration were manufactured in-house using both Cu and Pd-Ag metallizations. Microstructural characterisation...

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Institution:
University of Oxford
Oxford college:
Corpus Christi College
Department:
Mathematical,Physical & Life Sciences Division - Materials
Role:
Author

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Role:
Supervisor
Publication date:
2013
Type of award:
DPhil
Level of award:
Doctoral
Awarding institution:
Oxford University, UK
URN:
uuid:c9f90f13-fcc3-4bb4-8a2c-b980aacb89c9
Local pid:
ora:7940

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