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Residual stress measurement in thin films using the semi-destructive ring-core drilling method using Focused Ion Beam

Abstract:

In the present study, residual stress evaluation in thin films was achieved using a semi-destructive trench-cutting method. Focused Ion Beam (FIB) was employed to introduce the strain relief by ring-core milling, i.e. creating a trench around an "island". Either SEM or FIB imaging can be used to record sequences of images for strain change evaluation by Digital Image Correlation (DIC) analysis of micrographs. A regular array of shallow holes was drilled on a thin overlayer of Pt (∼100nm) depo...

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Publication status:
Published

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Authors


Belnoue, J More by this author
Sebastiani, M More by this author
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Journal:
11TH INTERNATIONAL CONFERENCE ON THE MECHANICAL BEHAVIOR OF MATERIALS (ICM11)
Volume:
10
Pages:
2190-2195
Publication date:
2011
DOI:
ISSN:
1877-7058
URN:
uuid:68ef5abe-c66d-4c85-8278-2e3e433d653f
Source identifiers:
305670
Local pid:
pubs:305670

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