- Abstract:
-
In the present study, residual stress evaluation in thin films was achieved using a semi-destructive trench-cutting method. Focused Ion Beam (FIB) was employed to introduce the strain relief by ring-core milling, i.e. creating a trench around an "island". Either SEM or FIB imaging can be used to record sequences of images for strain change evaluation by Digital Image Correlation (DIC) analysis of micrographs. A regular array of shallow holes was drilled on a thin overlayer of Pt (∼100nm) depo...
Expand abstract - Publication status:
- Published
- Publisher copy:
- 10.1016/j.proeng.2011.04.362
-
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- Journal:
- 11TH INTERNATIONAL CONFERENCE ON THE MECHANICAL BEHAVIOR OF MATERIALS (ICM11)
- Volume:
- 10
- Pages:
- 2190-2195
- Publication date:
- 2011
- DOI:
- ISSN:
-
1877-7058
- URN:
-
uuid:68ef5abe-c66d-4c85-8278-2e3e433d653f
- Source identifiers:
-
305670
- Local pid:
- pubs:305670
- Language:
- English
- Keywords:
- Copyright date:
- 2011
Journal article
Residual stress measurement in thin films using the semi-destructive ring-core drilling method using Focused Ion Beam
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