Encapsulation materials for flexible electronics

Thesis

Advancements in the encapsulation of flexible electronics have been significantly impeded by the limitations of water vapor barrier properties in protective layers. This study employs a novel defect imaging calcium test (Ca test) with a copper backing layer to explore and characterize defects that serve as permeation pathways leading to device failure. A foundational methodology was established by comparing estimated water vapor transmission rate (WVTR) values from the Ca test with those obta...

Expand abstract

Authors: Limkaichong, JS

• DOI: 10.5287/ora-o8qbago6r
• Type of award: DPhil
• Level of award: Doctoral
• Awarding institution: University of Oxford
• Language: English
• Keywords: Water Vapor Transmission Rate (WVTR); permeation mechanisms; encapsulation; aluminum oxide (AlOx / Al2O3); defect imaging; PVAl; AI-optimized.; calcium test; Atomic Layer Deposition (ALD); PET; Flexible electronics
• Subjects: Materials Science, Flexible Electronics, Nanotechnology, Surface Engineering, Polymers.