Electron mobility enhancement in solution-processed low-voltage In2O3 transistors via channel interface planarization

Journal article

The quality of the gate dielectric/semiconductor interface in thin-film transistors (TFTs) is known to determine the optimum operating characteristics attainable. As a result in recent years the development of methodologies that aim to improve the channel interface quality has become a priority. Herein, we study the impact of the surface morphology of three solution-processed high-k metal oxide dielectrics, namely AlOx, HfOx, and ZrOx, on the operating characteristics of In2O3 TFTs. Six different dielectric configurations were produced via single or double-step spin-casting of the various precursor formulations. All layers exhibited high areal capacitance in the range of 200 to 575 nF/cm2, hence proving suitable, for application in low-voltage n-channel In2O3 TFTs. Study of the surface topography of the various layers indicates that double spin-cast dielectrics exhibit consistently smoother layer surfaces and yield TFTs with improved operating characteristics manifested, primarily, as an increase in the electron mobility (μ). To this end, μ is found to increase from 1 to 2 cm2/Vs for AlOx, 1.8 to 6.4 cm2/Vs for HfOx, and 2.8 to 18.7 cm2/Vs for ZrOx-based In2O3 TFTs utilizing single and double-layer dielectric, respectively. The proposed method is simple and potentially applicable to other metal oxide dielectrics and semiconductors.

Authors: Mottram, A; Pattanasattayavong, P; Isakov, I; Wyatt-Moon, G; Faber, H

• Publication status: Published
• Peer review status: Peer reviewed
• Publisher: AIP Publishing
• Journal: AIP Advances
• Volume: 8
• Issue: 6
• Article number: 065015
• Publication date: 2018-06-13
• Acceptance date: 2018-06-05
• DOI: 10.1063/1.5036809
• EISSN: 2158-3226
• ISSN: 2158-3226
• Language: English
• Keywords: FFR