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Effect of film thickness, type of buffer layer, and substrate temperature on the morphology of dicyanovinyl-substituted sexithiophene films

Abstract:
The influence of film thickness, type of buffer underlayer, and deposition substrate temperature on the crystal structure, microstructure, and morphology of the films of dicyanovinyl-substituted sexithiophene with four butyl-chains (DCV6T-Bu4) is investigated by means of X-ray diffraction (XRD) and X-ray reflectivity methods. A neat Si wafer or a Si wafer covered by a 15 nm buffer underlayer of fullerene C60 or 9,9-Bis[4-(N,N-bis-biphenyl-4- yl-amino)phenyl]-9H-fluorene (BPAPF) is used as a substrate. The crystalline nature and ordered molecular arrangement of the films are recorded down to 6 nm film thickness. By using substrates heated up to 90 °C during the film deposition, the size of the DCV6T-Bu4 crystallites in direction perpendicular to the film surface increases up to value of the film thickness. With increasing deposition substrate temperature or film thickness, the DCV6T-Bu4 film relaxes, resulting in reducing the interplane distances closer to the bulk values. For the films of the same thickness deposited at the same substrate temperature, the DCV6T-Bu4 film relaxes for growth on Si to BPAPF to C60. Thicker films grown at heated substrates are characterized by smaller density, higher roughness and crystallinity and better molecular ordering. A thin (up to about 6 nm-thick) intermediate layer with linear density-gradient is formed at the C60/DCV6T-Bu4 interface for the films with buffer C60 layer. The XRD pattern of the DCV6T-Bu4 powder is indexed using triclinic unit cell parameters. © 2011 Elsevier B.V. All rights reserved.
Publication status:
Published
Peer review status:
Peer reviewed

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Publisher copy:
10.1016/j.tsf.2011.10.022

Authors



Publisher:
Elsevier
Journal:
Thin Solid Films More from this journal
Volume:
520
Issue:
7
Pages:
2479-2487
Publication date:
2012-01-31
DOI:
ISSN:
0040-6090


Language:
English
Keywords:
Pubs id:
pubs:405355
UUID:
uuid:f0e6fbef-e1d1-4829-948a-6573d76d67b9
Local pid:
pubs:405355
Source identifiers:
405355
Deposit date:
2013-09-26

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