Conference item icon

Conference item

Nanoindentation of lead free solders for harsh environments

Abstract:

To better understand the factors governing the reliability of lead free solders during severe excursions in temperature, the hardness and elastic modulus of the micro-phases formed in a Sn-Ag-Cu/Cu solder joint were characterized using nanoindentation at temperatures from 25 to 175°C. The creep behaviour of the different micro-phases was also studied as function of temperature. The hardness and elastic modulus of Qu6Sn5, Cu3Sn had a weak dependence on temperature, while primary Sn, eutectic r...

Expand abstract

Actions


Authors


More by this author
Institution:
University of Oxford
Division:
MPLS
Department:
Materials
Role:
Author
Volume:
1079
Pages:
70-78
Host title:
Materials Research Society Symposium Proceedings
Publication date:
2008-01-01
ISSN:
0272-9172
Source identifiers:
19085
ISBN:
9781605608648
Pubs id:
pubs:19085
UUID:
uuid:e5c44017-67fc-464c-83e9-13feedda2b85
Local pid:
pubs:19085
Deposit date:
2013-02-20

Terms of use


Views and Downloads






If you are the owner of this record, you can report an update to it here: Report update to this record

TO TOP