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Nanoindentation of lead free solders for harsh environments

Abstract:

To better understand the factors governing the reliability of lead free solders during severe excursions in temperature, the hardness and elastic modulus of the micro-phases formed in a Sn-Ag-Cu/Cu solder joint were characterized using nanoindentation at temperatures from 25 to 175°C. The creep behaviour of the different micro-phases was also studied as function of temperature. The hardness and elastic modulus of Qu6Sn5, Cu3Sn had a weak dependence on temperature, while primary Sn, eutectic r...

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Institution:
University of Oxford
Department:
Oxford, MPLS, Materials
Role:
Author
Volume:
1079
Pages:
70-78
Publication date:
2008-01-01
ISSN:
0272-9172
URN:
uuid:e5c44017-67fc-464c-83e9-13feedda2b85
Source identifiers:
19085
Local pid:
pubs:19085
ISBN:
9781605608648

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