Conference item

Nanoindentation of lead free solders for harsh environments

Abstract:: To better understand the factors governing the reliability of lead free solders during severe excursions in temperature, the hardness and elastic modulus of the micro-phases formed in a Sn-Ag-Cu/Cu solder joint were characterized using nanoindentation at temperatures from 25 to 175°C. The creep behaviour of the different micro-phases was also studied as function of temperature. The hardness and elastic modulus of Qu6Sn5, Cu3Sn had a weak dependence on temperature, while primary Sn, eutectic regions and electroplated Cu hardness and modulus were sensitive to temperature. Creep studies indicated that intermetallic were more creep resistant than softer phases that readily underwent creep, the type and rate of which was shown to be strongly temperature dependent. © 2008 Materials Research Society.

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APA Style

Marques, V., Grant, P., & Johnston, C. (2008). Nanoindentation of lead free solders for harsh environments. 1079, 70–78.

MLA Style

Marques, V, et al. “Nanoindentation of Lead Free Solders for Harsh Environments.” vol. 1079, 2008, pp. 70–78.

Chicago Style

Marques, V, P Grant, and C Johnston. 2008. “Nanoindentation of Lead Free Solders for Harsh Environments.” 1079: 70–78.
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Authors

+ Marques, V More by this author

Role:: Author

+ Grant, P More by this author

Role:: Author

+ Johnston, C More by this author

Institution:: University of Oxford
Division:: MPLS
Department:: Materials
Role:: Author

Host title:: Materials Research Society Symposium Proceedings
Volume:: 1079
Pages:: 70-78
Publication date:: 2008-01-01
ISSN:: 0272-9172
ISBN:: 9781605608648

Pubs id:: pubs:19085
UUID:: uuid:e5c44017-67fc-464c-83e9-13feedda2b85
Local pid:: pubs:19085
Source identifiers:: 19085
Deposit date:: 2013-02-20
ARK identifier:: ark:/29072/ora_e5c4401767fc464c83e913feedda2b85

Terms of use

Copyright date:: 2008

Licence:: Terms and Conditions of Use for Oxford University Research Archive

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