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Control of package warpage by package substrate design for low profile package-on-package structure

Abstract:

In recent years, with increasing demand for high-density assembly in mobile electronics products, a package-on-package (PoP) structure has been standardized. The demand for lowering the PoP profile is getting stronger as consumers demand thinner mobile devices. To assemble a low profile PoP and mount it on a mother board, it is necessary to have a precise warpage control of PoP components, including its bottom package. It is expected that a flip-chip chip-scale-package (FCCSP) with thin mold ...

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Authors


Furusawa, T More by this author
Kawamura, N More by this author
Furutani, T More by this author
Pages:
491-496
Publication date:
2012
URN:
uuid:dc81ede0-69c9-4aba-b2db-e4ed0a9438e2
Source identifiers:
403652
Local pid:
pubs:403652

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