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Nanomechanical characterization of Sn-Ag-Cu/Cu joints-Part 1: Young's modulus, hardness and deformation mechanisms as a function of temperature

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APA Style

Marques, V., Johnston, C., & Grant, P. (2013). Nanomechanical characterization of Sn-Ag-Cu/Cu joints-Part 1: Young's modulus, hardness and deformation mechanisms as a function of temperature. ACTA MATERIALIA, 61(7), 2460–2470.

MLA Style

Marques, V., et al. “Nanomechanical Characterization of Sn-Ag-Cu/Cu Joints-Part 1: Young's Modulus, Hardness and Deformation Mechanisms as a Function of Temperature.” ACTA MATERIALIA, vol. 61, no. 7, 2013, pp. 2460–70.

Chicago Style

Marques, V, C Johnston, and P Grant. 2013. “Nanomechanical Characterization of Sn-Ag-Cu/Cu Joints-Part 1: Young's Modulus, Hardness and Deformation Mechanisms as a Function of Temperature.” ACTA MATERIALIA 61 (7): 2460–70.
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Publisher copy:: 10.1016/j.actamat.2013.01.019

Authors

+ Marques, V More by this author

Role:: Author

+ Johnston, C More by this author

Institution:: University of Oxford
Division:: MPLS
Department:: Materials
Role:: Author

+ Grant, P More by this author

Institution:: University of Oxford
Division:: MPLS
Department:: Materials
Role:: Author

Journal:: ACTA MATERIALIA More from this journal
Volume:: 61
Issue:: 7
Pages:: 2460-2470
Publication date:: 2013-04-01
DOI:: 10.1016/j.actamat.2013.01.019
ISSN:: 1359-6454

Keywords:: Aerospace applications

Intermetallics

Reliability

Lead-free solders

High-temperature nanoindentation
Pubs id:: pubs:384724
UUID:: uuid:db3d41c1-1f2e-4251-a539-802260f88f04
Local pid:: pubs:384724
Source identifiers:: 384724
Deposit date:: 2013-11-17

Terms of use

Copyright date:: 2013

Licence:: Terms and Conditions of Use for Oxford University Research Archive

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