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Low profile fan and heat sink thermal management solution for portable applications

Abstract:

The increasing heat flux densities from portable electronics are leading to new methodologies being implemented to provide thermal management within such devices. Many technologies are under development to transport heat within electronic equipment to allow it to be dissipated into the surroundings via conduction, natural convection and radiation. Few have considered the approach of implementing a forced convection cooling solution in such devices. This work addresses the potential of low pro...

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Publication status:
Published

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Institution:
University of Oxford
Department:
Oxford, MPLS, Engineering Science
Journal:
INTERNATIONAL JOURNAL OF THERMAL SCIENCES
Volume:
46
Issue:
11
Pages:
1182-1190
Publication date:
2007-11-05
DOI:
ISSN:
1290-0729
URN:
uuid:c57a6a1a-bab8-4c4b-9b53-d8b0286a82a8
Source identifiers:
369500
Local pid:
pubs:369500

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