Assessment of the reliability of high temperature electronics packaging technology

Journal article

The requirement to install electronic power and control systems in high temperature environments has posed a challenge to the traditional limit of 125°C for high temperature exposure of electronics systems. The leap in operating temperature to above 200°C in combination with high pressures, vibrations and potentially corrosive environments means that different semiconductors, passives, circuit boards and assembly processes will be needed to fulfil the target performance specifications. The reliability data built over many years and enshrined in MIL-HDBK-217 for the operation of electronics systems from -55°C to +125°C do not apply to the operation of electronics at higher temperature, as the failures may be more dominated by diffusion and creep rather than fatigue. The basis of the approach being pursued in this work is to model the mechanical, electrical and thermal characterisation and microstructural analysis of representative high temperature test structures. This model will enable relevant failure modes to be identified and will devise highly accelerated test conditions for high temperature electronics. This work forms part of the UPTEMP project has been set-up with support from UK Technology Strategy Board and the EPSRC, which started in March 2007 with 3 years duration. The project brings together a consortium of end-users (Sondex Wireline and Vibro-Meter UK), electronic module manufacturers (GE Aviation Systems Newmarket/Tewkesbury) and material suppliers (Gwent Electronic Materials and Thermastrate Ltd) with Oxford University - Materials Department, the leading UK high temperature electronics research centre.

Authors: Riches, S; Johnston, C; Sousa, M; Grant, P; Gulliver, J

• Journal: International Conference and Exhibition on High Temperature Electronics 2008, HiTEC 2008
• Pages: 265-272
• Publication date: 2008-01-01
• Language: English
• Keywords: Reliability assessment; Microstructural analysis; Nano-indentation; High temperature electronics packaging