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Assessment of the reliability of high temperature electronics packaging technology

Abstract:

The requirement to install electronic power and control systems in high temperature environments has posed a challenge to the traditional limit of 125°C for high temperature exposure of electronics systems. The leap in operating temperature to above 200°C in combination with high pressures, vibrations and potentially corrosive environments means that different semiconductors, passives, circuit boards and assembly processes will be needed to fulfil the target performance specifications. The re...

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Authors


Riches, ST More by this author
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Institution:
University of Oxford
Department:
Oxford, MPLS, Materials
Gulliver, J More by this author
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Journal:
International Conference and Exhibition on High Temperature Electronics 2008, HiTEC 2008
Pages:
265-272
Publication date:
2008
URN:
uuid:96a00aa1-8a8b-4f4b-a31f-16b938570989
Source identifiers:
415299
Local pid:
pubs:415299

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