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Cryogenic rds(on) of a GaN power transistor at high currents

Abstract:
The dramatic reduction in the on-state resistance of Gallium Nitride (GaN) HEMTs at cryogenic temperatures can be exploited to reduce conduction losses in power converters. In this paper, we present a low-cost and easily implementable methodology for the characterisation of the on-state resistance of power transistors below room temperature. Experimental results for a 650 V 30 A GaN HEMT are compared to measurements in the existing literature. In addition, the variation of the onstate resistance to drain-source current at currents in excess of the datasheet rating of the transistor is examined. Thermal equilibrium is obtained with continuous high currents. The conditions for the onset of thermal instability are analysed and compared to experimental results. Thermally stable operation at three times the room-temperature rating of the transistor is demonstrated at cryogenic temperatures.
Publication status:
Published
Peer review status:
Peer reviewed

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Publisher copy:
10.1109/ECCE53617.2023.10362538

Authors


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Institution:
University of Oxford
Division:
MPLS
Department:
Engineering Science
Oxford college:
Green Templeton College
Role:
Author
ORCID:
0009-0008-2774-6300
More by this author
Institution:
University of Oxford
Division:
MPLS
Department:
Engineering Science
Role:
Author


Publisher:
IEEE
Host title:
Proceedings of the IEEE Energy Conversion Conference and Expo (ECCE 2023)
Pages:
5743-5748
Publication date:
2023-12-29
Acceptance date:
2023-08-30
Event title:
IEEE Energy Conversion Conference and Expo (ECCE 2023)
Event location:
Nashville, TN, USA
Event website:
https://www.ieee-ecce.org/2023/
Event start date:
2023-10-29
Event end date:
2023-11-02
DOI:
EISSN:
2329-3748
ISSN:
2329-3721


Language:
English
Keywords:
Pubs id:
1526297
Local pid:
pubs:1526297
Deposit date:
2023-09-13

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