Conference item
Cryogenic rds(on) of a GaN power transistor at high currents
- Abstract:
- The dramatic reduction in the on-state resistance of Gallium Nitride (GaN) HEMTs at cryogenic temperatures can be exploited to reduce conduction losses in power converters. In this paper, we present a low-cost and easily implementable methodology for the characterisation of the on-state resistance of power transistors below room temperature. Experimental results for a 650 V 30 A GaN HEMT are compared to measurements in the existing literature. In addition, the variation of the onstate resistance to drain-source current at currents in excess of the datasheet rating of the transistor is examined. Thermal equilibrium is obtained with continuous high currents. The conditions for the onset of thermal instability are analysed and compared to experimental results. Thermally stable operation at three times the room-temperature rating of the transistor is demonstrated at cryogenic temperatures.
- Publication status:
- Published
- Peer review status:
- Peer reviewed
Actions
Access Document
- Files:
-
-
(Preview, Accepted manuscript, pdf, 3.5MB, Terms of use)
-
- Publisher copy:
- 10.1109/ECCE53617.2023.10362538
Authors
- Publisher:
- IEEE
- Host title:
- Proceedings of the IEEE Energy Conversion Conference and Expo (ECCE 2023)
- Pages:
- 5743-5748
- Publication date:
- 2023-12-29
- Acceptance date:
- 2023-08-30
- Event title:
- IEEE Energy Conversion Conference and Expo (ECCE 2023)
- Event location:
- Nashville, TN, USA
- Event website:
- https://www.ieee-ecce.org/2023/
- Event start date:
- 2023-10-29
- Event end date:
- 2023-11-02
- DOI:
- EISSN:
-
2329-3748
- ISSN:
-
2329-3721
- Language:
-
English
- Keywords:
- Pubs id:
-
1526297
- Local pid:
-
pubs:1526297
- Deposit date:
-
2023-09-13
Terms of use
- Copyright holder:
- IEEE
- Copyright date:
- 2023
- Rights statement:
- © IEEE 2023
- Notes:
- This paper will be presented at the IEEE Energy Conversion Conference and Expo (ECCE 2023), 29th October - 2nd November 2023, Nashville, TN, USA. This is the accepted manuscript version of the article. The final version is available online from IEEE at: https://doi.org/10.1109/ECCE53617.2023.10362538
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