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A unified picture of aggregate formation in a model polymer semiconductor during solution processing

Abstract:
One grand challenge for printed organic electronics is the development of a knowledge platform that describes how polymer semiconductors assemble from solution, which requires a unified picture of the complex interplay of polymer solubility, mass transport, nucleation and, e.g., vitrification. One crucial aspect, thereby, is aggregate formation, i.e., the development of electronic coupling between adjacent chain segments. Here, it is shown that the critical aggregation temperatures in solution (no solvent evaporation allowed) and during film formation (solvent evaporation occurring) are excellent pointers to i) establish reliable criteria for polymer assembly into desired aggregates, and ii) advance mechanistic understanding of the overall polymer assembly. Indeed, important insights are provided on why aggregation occurs via a 1- or 2-step process depending on polymer solubility, deposition temperature and solvent evaporation rate; and the selection of deposition temperatures for specific scenarios (e.g., good vs bad solvent) is demystified. Collectively, it is demonstrated that relatively straightforward, concurrent in situ time-resolved absorbance and photoluminescence spectroscopies to monitor aggregate formation lead to highly useful and broadly applicable criteria for processing functional plastics. In turn, improved control over their properties and device performance can be obtained toward manufacturing sensors, energy-harvesting devices and, e.g., bioelectronics systems at high yield.
Publication status:
Published
Peer review status:
Peer reviewed

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Publisher copy:
10.1002/adfm.202314729

Authors



Publisher:
Wiley
Journal:
Advanced Functional Materials More from this journal
Volume:
34
Issue:
50
Article number:
2314729
Publication date:
2024-02-13
Acceptance date:
2024-01-20
DOI:
EISSN:
1616-3028
ISSN:
1616-301X


Language:
English
Keywords:
Pubs id:
1603712
Local pid:
pubs:1603712
Deposit date:
2024-01-22

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