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On the characterisation of finned and finless heat sinks for portable electronics

Abstract:

Reliable and efficient cooling solutions for portable electronic devices are now at the forefront of research due to consumer demand for manufacturers to downscale their existing technologies. The power required for these technologies now has to be dissipated over smaller areas resulting in elevated heat fluxes. The most popular choice among engineers in terms of cooling solutions is to integrate a fan with a heat sink and for portable electronic devices this involves the use of a low profile...

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Publication status:
Published

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Publisher copy:
10.1115/ICNMM2007-30089

Authors

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Institution:
University of Oxford
Division:
MPLS
Department:
Engineering Science
Role:
Author
Journal:
ICNMM2007: PROCEEDINGS OF THE 5TH INTERNATIONAL CONFERENCE ON NANOCHANNELS, MICROCHANNELS, AND MINICHANNELS More from this journal
Pages:
209-218
Publication date:
2007-01-01
DOI:
Language:
English
Keywords:
Pubs id:
pubs:369491
UUID:
uuid:7e2b55c5-8de5-4e53-b46a-2cb21bad83f9
Local pid:
pubs:369491
Source identifiers:
369491
Deposit date:
2013-11-16

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