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Influence of the hole transporting layer on the thermal stability of inverted organic photovoltaics using accelerated-heat lifetime protocols

Abstract:
High power conversion efficiency (PCE) inverted organic photovoltaics (OPVs) usually use thermally evaporated MoO3 as a hole transporting layer (HTL). Despite the high PCE values reported, stability investigations are still limited and the exact degradation mechanisms of inverted OPVs using thermally evaporated MoO3 HTL remain unclear under different environmental stress factors. In this study, we monitor the accelerated lifetime performance under the ISOS-D-2 protocol (heat conditions 65 °C) of nonencapsulated inverted OPVs based on the thiophene-based active layer materials poly(3-hexylthiophene) (P3HT), poly[[4,8-bis[(2-ethylhexyl)oxy]benzo[1,2-b:4,5-b']dithiophene-2,6-diyl][3-fluoro-2-[(2-ethylhexyl)carbonyl]thieno[3,4-b]thiophenediyl]] (PTB7), and thieno[3,2-b]thiophene-diketopyrrolopyrrole (DPPTTT) blended with [6,6]-phenyl C71-butyric acid methyl ester (PC[70]BM). The presented investigation of degradation mechanisms focus on optimized P3HT:PC[70]BM-based inverted OPVs. Specifically, we present a systematic study on the thermal stability of inverted P3HT:PC[70]BM OPVs using solution-processed poly(3,4-ethylenedioxythiophene):polystyrene sulfonate (PEDOT:PSS) and evaporated MoO3 HTL. Using a series of measurements and reverse engineering methods, we report that the P3HT:PC[70]BM/MoO3 interface is the main origin of failure of the P3HT:PC[70]BM-based inverted OPVs under intense heat conditions, a trend that is also observed for the other two thiophene-based polymers used in this study.
Publication status:
Published
Peer review status:
Peer reviewed

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Publisher copy:
10.1021/acsami.7b01183

Authors


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Role:
Author
ORCID:
0000-0001-8353-7345


Publisher:
American Chemical Society
Journal:
ACS Applied Materials and Interfaces More from this journal
Volume:
9
Issue:
16
Pages:
14136-14144
Publication date:
2017-03-30
Acceptance date:
2017-03-30
DOI:
EISSN:
1944-8252
ISSN:
1944-8244
Pmid:
28357861


Language:
English
Keywords:
Pubs id:
pubs:693468
UUID:
uuid:7338e931-2da2-44e8-879d-34fc0c268955
Local pid:
pubs:693468
Source identifiers:
693468
Deposit date:
2018-01-29

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