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Grain Boundary Sliding in Tin

Abstract:

Grain boundary sliding is an important deformation mechanism that contributes to creep and superplastic forming. In tin-based lead-free solders grain boundary sliding can make significant contributions to in service performance. Novel microcompression tests designed to isolate individual grain boundaries and assess their mechanical resistance to sliding were conducted on tin. The boundary sliding deformation was more obvious for smaller sample cross-sections and made a larger contribution to ...

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Department:
University of Oxford
Role:
Researcher
Department:
University of Oxford
Role:
Principal Investigator
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Grant:
EP/G004676/1
Funding agency for:
Project
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Grant:
EP/K039237/1
Funding agency for:
Jicheng Gong
Publisher:
University of Oxford
Publication date:
2015
DOI:
Data collected:
2014 - 2015
Language:
English
Keywords:
Subjects:
Format:
Digital
Documentation:
Grain boundary sliding is an important deformationmechanism at higher temperatures (relative to the melting point) and can make significant contributions in creep and superplastic deformation regimes. Here we make available data from compression tests on micro-pillars machined by focused ion beam into single and bi-crystals of pure tin. The data demonstrate marked size effects with the strength increasing for single and bi-crystals as the sample size is reduced. For the bu-crystals the frac... Expand documentation

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