Journal article
Inhomogeneous strain release during bending of WS2 on flexible substrates
- Abstract:
-
Two-dimensional (2D) materials hold great promise in flexible electronics, but the weak van der Waals interlayer bonding may pose a problem during bending, where easy interlayer sliding can occur. Furthermore, thin films of rigid materials are often observed to delaminate from soft substrates during straining. Here, we study the influence of substrate strain on some of the heterostructure configurations we expect to find in devices, composed of three common 2D materials: graphene, tungsten di...
Expand abstract
- Publication status:
- Published
- Peer review status:
- Peer reviewed
Actions
Authors
Funding
+ Engineering and Physical Sciences Research Council
More from this funder
Funding agency for:
Tweedie, M
Sarwat, S
Bhaskaran, H
Grant:
EP/M50659X/1
EP/M015173/1
EP/M015173/1
Bibliographic Details
- Publisher:
- American Chemical Society Publisher's website
- Journal:
- ACS Applied Materials and Interfaces Journal website
- Volume:
- 10
- Issue:
- 45
- Pages:
- 39177–39186
- Publication date:
- 2018-11-01
- Acceptance date:
- 2018-10-23
- DOI:
- EISSN:
-
1944-8252
- ISSN:
-
1944-8244
- Pmid:
-
30383356
Item Description
- Language:
- English
- Keywords:
- Pubs id:
-
pubs:936741
- UUID:
-
uuid:631817aa-851a-4c67-a14b-cf1f30d2a09d
- Local pid:
- pubs:936741
- Source identifiers:
-
936741
- Deposit date:
- 2018-11-15
Terms of use
- Copyright holder:
- American Chemical Society
- Copyright date:
- 2018
- Notes:
- Copyright © 2018 American Chemical Society. This is the accepted manuscript version of the article. The final version is available online from American Chemical Society at: https://doi.org/10.1021/acsami.8b12707
Metrics
If you are the owner of this record, you can report an update to it here: Report update to this record