Journal article
Dielectric surface passivation for silicon solar cells: A review
- Abstract:
- Silicon wafer solar cells continue to be the leading photovoltaic technology, and in many places are now providing a substantial portion of electricity generation. Further adoption of this technology will require processing that minimises losses in device performance. A fundamental mechanism for efficiency loss is the recombination of photo-generated charge carriers at the unavoidable cell surfaces. Dielectric coatings have been shown to largely prevent these losses through a combination of different passivation mechanisms. This review aims to provide an overview of the dielectric passivation coatings developed in the past two decades using a standardised methodology to characterise the metrics of surface recombination across all techniques and materials. The efficacy of a large set of materials and methods has been evaluated using such metrics and a discussion on the current state and prospects for further surface passivation improvements is provided.
- Publication status:
- Published
- Peer review status:
- Peer reviewed
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(Preview, Version of record, pdf, 1.4MB, Terms of use)
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- Publisher copy:
- 10.1002/pssa.201700293
Authors
+ Engineering and Physical Sciences Research Council
More from this funder
- Funding agency for:
- Bonilla Osorio, R
- Hamer, P
- Wilshaw, P
- Grant:
- Postdoctoral Research Fellowship, EP/M022196/1
- EP/M024911/1
- EP/M024911/1
- Publisher:
- Wiley
- Journal:
- Physica Status Solidi A: Applications and Materials Science More from this journal
- Volume:
- 214
- Issue:
- 7
- Article number:
- 1700293
- Publication date:
- 2017-06-12
- Acceptance date:
- 2017-05-10
- DOI:
- EISSN:
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1862-6319
- ISSN:
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1862-6300
- Keywords:
- Pubs id:
-
pubs:700272
- UUID:
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uuid:4ac8f764-4296-4a1f-b48f-081137b0057f
- Local pid:
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pubs:700272
- Source identifiers:
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700272
- Deposit date:
-
2017-06-13
Terms of use
- Copyright holder:
- Bonilla et al
- Copyright date:
- 2017
- Notes:
-
Copyright © 2017 The Authors. Published by Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim
This is an open access article under the terms of the Creative Commons Attribution License, which permits use, distribution and reproduction in any medium, provided the original work is properly cited.
- Licence:
- CC Attribution (CC BY)
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