Enhancing conductivity of silver nanowire networks through surface engineering using bidentate rigid ligands

Journal article

Solution processable metallic nanomaterials present a convenient way to fabricate conductive structures, which are necessary in all electronic devices. However, they tend to require post-treatments to remove the bulky ligands around them to achieve high conductivity. In this work, we present a method to formulate a post-treatment free conductive silver nanowire ink by controlling the type of ligands around the silver nanowires. We found that bidentate ligands with a rigid molecular structure were effective in improving the conductivity of the silver nanowire networks as they could maximize the number of linkages between neighboring nanowires. In addition, DFT calculations also revealed that ligands with good LUMO to silver energy alignment were more effective. Because of these reasons, fumaric acid was found to be the most effective ligand and achieved a large reduction in sheet resistance of 70% or higher depending on the nanowire network density. The concepts elucidated from this study would also be applicable to other solution processable nanomaterials systems such as quantum dots for photovoltaics or LEDs which also require good charge transport being neighboring nanoparticles.

Authors: Liu, WC; Prentice, JCA; Patrick, CE; Watt, AAR

• Publication status: Published
• Peer review status: Peer reviewed
• Publisher: American Chemical Society
• Journal: ACS Applied Materials and Interfaces
• Volume: 16
• Issue: 3
• Pages: 4150-4159
• Place of publication: United States
• Publication date: 2024-01-10
• Acceptance date: 2023-12-18
• DOI: 10.1021/acsami.3c15207
• EISSN: 1944-8252
• ISSN: 1944-8244
• Pmid: 38197866
• Language: English
• Keywords: flexible electronics; conductive films; FFR; molecular junctions; silver nanowires; ligand exchange