Journal article
The self-assembly of DNA Holliday junctions studied with a minimal model
- Abstract:
- In this paper, we explore the feasibility of using coarse-grained models to simulate the self-assembly of DNA nanostructures. We introduce a simple model of DNA where each nucleotide is represented by two interaction sites corresponding to the sugar-phosphate backbone and the base. Using this model, we are able to simulate the self-assembly of both DNA duplexes and Holliday junctions from single-stranded DNA. We find that assembly is most successful in the temperature window below the melting temperatures of the target structure and above the melting temperature of misbonded aggregates. Furthermore, in the case of the Holliday junction, we show how a hierarchical assembly mechanism reduces the possibility of becoming trapped in misbonded configurations. The model is also able to reproduce the relative melting temperatures of different structures accurately and allows strand displacement to occur.
- Publication status:
- Published
- Peer review status:
- Peer reviewed
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Access Document
- Files:
-
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(Preview, Accepted manuscript, pdf, 341.7KB, Terms of use)
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- Publisher copy:
- 10.1063/1.3055595
Authors
- Publisher:
- American Institute of Physics
- Journal:
- Journal of Chemical Physics More from this journal
- Volume:
- 130
- Issue:
- 6
- Article number:
- 065101
- Publication date:
- 2009-02-01
- DOI:
- EISSN:
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1089-7690
- ISSN:
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0021-9606
- Language:
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English
- Keywords:
- Pubs id:
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pubs:17176
- UUID:
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uuid:31df47cf-486b-4cf6-93be-96be489ccae8
- Local pid:
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pubs:17176
- Source identifiers:
-
17176
- Deposit date:
-
2013-03-20
Terms of use
- Copyright holder:
- American Institute of Physics
- Copyright date:
- 2009
- Notes:
- Copyright 2009 American Institute of Physics. This article may be downloaded for personal use only. Any other use requires prior permission of the author and the American Institute of Physics. The following article appeared in Journal of Chemical Physics 130, 065101 (2009) and may be found at http://link.aip.org/link/?jcp/130/065101.
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