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High performance cooling system for automotive inverters

Abstract:

A novel double-side cooled power module is presented which delivers superior cooling performance with the potential for improved robustness to thermal cycling. The semiconductor dies are sandwiched between conventional DBC substrates, the substrates being directly cooled rather than through a conventional heat spreader heat sink assembly. A theoretical analysis is presented illustrating that direct cooling can offer a lower total thermal resistance provided the heat transfer coefficient at th...

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Publisher copy:
10.1109/EPE.2007.4417363

Authors


Johnson, CM More by this author
Ireland, P More by this author
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Journal:
2007 European Conference on Power Electronics and Applications, EPE
Publication date:
2007
DOI:
URN:
uuid:1c9be532-21a4-46bd-93f6-a7fff4be6bae
Source identifiers:
396451
Local pid:
pubs:396451

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