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From chip to cooling tower data center modeling: Chip leakage power and its impact on cooling infrastructure energy efficiency

Abstract:

The power consumption of the chip package is known to vary with operating temperature, independently of the workload processing power. This variation is commonly known as chip leakage power, typically accounting for ~ 10% of total chip power consumption. The influence of operating temperature on leakage power consumption is a major concern for the information technology (IT) industry for design optimization where IT system power densities are steadily increasing and leakage power expected to ...

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Publisher copy:
10.1115/1.4007744

Authors


Journal:
Journal of Electronic Packaging, Transactions of the ASME More from this journal
Volume:
134
Issue:
4
Pages:
041009-041009
Publication date:
2012-01-01
DOI:
EISSN:
1528-9044
ISSN:
1043-7398
Language:
English
Pubs id:
pubs:377837
UUID:
uuid:06f86a22-c691-4e88-b086-3ac73c3cc049
Local pid:
pubs:377837
Source identifiers:
377837
Deposit date:
2013-11-16

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