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Microstructural evolution at Cu/Sn-Ag-Cu/Cu and Cu/Sn-Ag-Cu/Ni-Au ball grid array interfaces during thermal ageing

Abstract:

The effect of metallization chemistry on the solid state growth kinetics of intermetallics formed in an industrial metallization/solder/metallization arrangement during isothermal ageing has been studied. During isothermal ageing of the Cu/Sn-Ag-Cu/Cu arrangement at temperatures lower than 125 °C, Cu was the main mobile element and diffused either through or along interfacial Cu 6Sn5 grain boundaries to react with Sn on the solder side of the Cu6Sn5 layer; while for temperatures greater than ...

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Publication status:
Published

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Authors


Marques, VMF More by this author
More by this author
Institution:
University of Oxford
Department:
Oxford, MPLS, Materials
More by this author
Institution:
University of Oxford
Department:
Oxford, MPLS, Materials
Publisher:
Elsevier Ltd
Journal:
JOURNAL OF ALLOYS AND COMPOUNDS
Volume:
613
Pages:
387-394
Publication date:
2014-11-15
DOI:
ISSN:
0925-8388
URN:
uuid:04537fb2-9fa3-4d1f-a63c-b5c85c728e06
Source identifiers:
476756
Local pid:
pubs:476756

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