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Precision scans of the Pixel cell response of double sided 3D Pixel detectors to pion and X-ray beams

Abstract:

Three-dimensional (3D) silicon sensors offer potential advantages over standard planar sensors for radiation hardness in future high energy physics experiments and reduced charge-sharing for X-ray applications, but may introduce inefficiencies due to the columnar electrodes. These inefficiencies are probed by studying variations in response across a unit pixel cell in a 55μm pitch double-sided 3D pixel sensor bump bonded to TimePix and Medipix2 readout ASICs. Two complementary characterisatio...

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Publication status:
Published

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Authors


Mac Raighne, A More by this author
Alianelli, L More by this author
van Beuzekom, M More by this author
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Journal:
JOURNAL OF INSTRUMENTATION
Volume:
6
Issue:
5
Pages:
P05002-P05002
Publication date:
2011-05-05
DOI:
EISSN:
1748-0221
ISSN:
1748-0221
URN:
uuid:bb7201ed-e572-4ddd-a1b9-2d1f526fccc4
Source identifiers:
333882
Local pid:
pubs:333882

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