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Broad ion beam milling of focused ion beam prepared transmission electron microscopy cross-section specimens for high resolution electron microscopy using silicon support membranes

Abstract:

The use of focused ion beam systems is becoming routine for the preparation of site specific TEM cross-section specimens which are typically 50-100 nm. thick. Generally, the cross-sections are milled using a 30 keV ion beam, which unfortunately, can result in large amounts of damage to the sidewalls of the cross-sections. This damage layer limits the minimum thickness to which a crystalline cross-section can be prepared and affects the quality of the images using high resolution electron micr...

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Publication status:
Published

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Issue:
169
Pages:
511-514
Publication date:
2001-01-01
ISSN:
0951-3248
URN:
uuid:93731a90-2694-40dd-b151-b4b736458c55
Source identifiers:
25924
Local pid:
pubs:25924
ISBN:
0-7503-0818-4

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