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Finless heat sinks, high performance and low cost for low profile cooling applications

Abstract:

The need for low profile, sustainable thermal management solutions is becoming critical in information and communications technology applications ranging from consumer products to server cabinets. This work presents a finless thermal management solution that utilizes fluidic structures generated within an empty cavity to enhance the heat transfer coefficient. The finless thermal management solution can be manufactured to have a height of less than 5mm when using low profile motors. Particle i...

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Publisher copy:
10.1115/1.4023267
Journal:
Journal of Thermal Science and Engineering Applications More from this journal
Volume:
5
Issue:
3
Pages:
031001-031001
Publication date:
2013-06-24
DOI:
EISSN:
1948-5093
ISSN:
1948-5085
Language:
English
Pubs id:
pubs:426835
UUID:
uuid:8c554a38-6a61-4a0a-82f8-dc296ffc95f1
Local pid:
pubs:426835
Source identifiers:
426835
Deposit date:
2013-11-16

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