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FINLESS heat sinks, high performance and low cost for low profile cooling applications

Abstract:

The need for low profile, sustainable thermal management solutions is becoming a critical need in electronics from consumer products to server cabinets. This work presents a FINLESS thermal management solution that utilises fluidic structures generated within it to enhance the heat transfer performance. The FINLESS thermal management solution can be manufactured to have a height of ∼5mm or even less when using low profile motors. Particle Image Velocimetry (PIV) combined with Infra-Red (IR) i...

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Publication status:
Published

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Institution:
University of Oxford
Department:
Oxford, MPLS, Engineering Science
Stafford, J More by this author
Journal:
PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2011, VOL 10, PTS A AND B
Volume:
10
Issue:
PARTS A AND B
Pages:
1-9
Publication date:
2012
URN:
uuid:87a39073-43e7-42bd-8854-6b57d8985657
Source identifiers:
369440
Local pid:
pubs:369440
Language:
English

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