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Thesis

Lead free solders for aerospace applications

Abstract:

The factors controlling the reliability of Pb-free solders when subject to thermomechanical regimes relevant to the harsh aerospace environment have been studied. Ball grid array (BGAs) typical of microelectronic devices have been manufactured in-house and subjected to isothermal ageing and thermal cycling. The BGAs comprised both Cu and Ni-Au metallizations, Pb-free Sn-Ag-Cu 400 and 600μm solder balls, FR4 and Al2O3 boards, and included circuits to measure resistance ch...

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Institution:
University of Oxford
Research group:
Advance Materials Group - Department of Materials
Oxford college:
St Edmund Hall
Department:
Mathematical,Physical & Life Sciences Division - Materials

Contributors

Role:
Supervisor
Role:
Supervisor
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Funding agency for:
Vitor Manuel Farinha Marques
Publication date:
2010
Type of award:
DPhil
Level of award:
Doctoral
Awarding institution:
Oxford University, UK
URN:
uuid:85707054-bc46-44f3-b9c6-9fd29358ad25
Local pid:
ora:11958

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