Thesis
Lead free solders for aerospace applications
- Abstract:
-
The factors controlling the reliability of Pb-free solders when subject to thermomechanical regimes relevant to the harsh aerospace environment have been studied. Ball grid array (BGAs) typical of microelectronic devices have been manufactured in-house and subjected to isothermal ageing and thermal cycling. The BGAs comprised both Cu and Ni-Au metallizations, Pb-free Sn-Ag-Cu 400 and 600μm solder balls, FR4 and Al2O3 boards, and included circuits to measure resistance ch...
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Authors
Contributors
+ Grant, P
Division:
MPLS
Department:
Materials
Role:
Supervisor
+ Johnston, C
Division:
MPLS
Department:
Materials
Role:
Supervisor
Funding
+ Engineering and Physical Sciences Research Council
More from this funder
Funding agency for:
Farinha Marques, VM
Bibliographic Details
- Publication date:
- 2010
- Type of award:
- DPhil
- Level of award:
- Doctoral
- Awarding institution:
- University of Oxford
Item Description
- Language:
- English
- Keywords:
- Subjects:
- UUID:
-
uuid:85707054-bc46-44f3-b9c6-9fd29358ad25
- Local pid:
- ora:11958
- Deposit date:
- 2015-07-28
Terms of use
- Copyright holder:
- Farinha Marques, V
- Copyright date:
- 2010
- Notes:
- This thesis is not currently available in ORA
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