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Journal article

Interdiffusion and barrier layer formation in thermally evaporated Mn/Cu heterostructures on SiO2 substrates

Abstract:

Mn/Cu heterostructures thermally evaporated onto SiO2 and, subsequently, annealed were investigated by transmission electron microscopy related techniques in order to study the diffusion interactions which lead to barrier layer formation. Energy dispersive x-ray spectroscopy and electron energy loss spectroscopy provide evidence for the interdiffusion between the Mn and Cu layers following a 450°C anneal, where the Mn diffuses toward the surface of the structure, while Cu diffuses toward the ...

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Publication status:
Published

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Publisher copy:
10.1063/1.3569146

Authors


Lozano, JG More by this author
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Institution:
University of Oxford
Department:
Oxford, MPLS, Materials
Brennan, B More by this author
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Journal:
APPLIED PHYSICS LETTERS
Volume:
98
Issue:
12
Pages:
123112-123112
Publication date:
2011-03-21
DOI:
ISSN:
0003-6951
URN:
uuid:7d532a0c-9984-4903-af0e-0a620533c921
Source identifiers:
132468
Local pid:
pubs:132468
Language:
English

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