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Nano-scale residual stress depth profiling in Cu/W nano-multilayers as a function of magnetron sputtering pressure

Abstract:

Residual stresses in thin films and multi-layered coatings fabricated by physical vapour deposition largely affect their mechanical and thermal reliability during operation in numerous fields of applications. By changing the argon working pressure in between each multilayer planar DC magnetron sputter deposition step, it is possible to control the residual stress distribution within coatings. A combination of FIB-DIC ring-core strain analysis, synchrotron XRD analysis based on the sin2(Ψ) met...

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Publication status:
Published
Peer review status:
Peer reviewed

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Institution:
University of Oxford
Department:
Engineering Science
Role:
Author
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Publisher:
Elsevier Publisher's website
Journal:
Surface and Coatings Technology Journal website
Volume:
381
Article number:
125142
Publication date:
2019-11-22
Acceptance date:
2019-11-05
DOI:
EISSN:
1879-3347
ISSN:
0257-8972
Pubs id:
pubs:1080075
UUID:
uuid:6c55010c-52ba-460f-8961-0703f1b4c2d4
Source identifiers:
1080075
Local pid:
pubs:1080075

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