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Electrical design and characterization of Si interposer for system-in-package (SiP)

Abstract:

Si interposer technology has the potential to enable highbandwidth and low-power image processing devices of the future, because a very high density system with an ultra-fine pitch (≤5um) wiring can be fabricated. However, the ultrafine pitch wiring may adversely affect the electrical performance of devices. This paper discusses the signal propagation properties of ultra-fine coplanar interconnects on Si interposers. A design chart of the interconnects, obtained from the viewpoint of maximum ...

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Publisher copy:
10.1109/ECTC.2009.5074236

Authors


Hasegawa, K More by this author
Bhandari, RK More by this author
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Pages:
1648-1653
Publication date:
2009
DOI:
ISSN:
0569-5503
URN:
uuid:6aa1aa8a-a385-4b0c-ae0c-65b191c9389c
Source identifiers:
296403
Local pid:
pubs:296403
ISBN:
9781424444762

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