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Interdiffusion and barrier layer formation in thermally evaporated Mn/Cu heterostructures on SiO substrates

Abstract:: Mn/Cu heterostructures thermally evaporated onto SiO and, subsequently, annealed were investigated by transmission electron microscopy related techniques in order to study the diffusion interactions which lead to barrier layer formation. Energy dispersive x-ray spectroscopy and electron energy loss spectroscopy provide evidence for the interdiffusion between the Mn and Cu layers following a 450°C anneal, where the Mn diffuses toward the surface of the structure, while Cu diffuses toward the M...
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APA Style

Lozano, J., Bogan, J., Brennan, B., Hughes, G., Lozano-Perez, S., Nellist, P., & Wang, Y. (2011). Interdiffusion and barrier layer formation in thermally evaporated Mn/Cu heterostructures on SiO substrates. Applied Physics Letters, 98(12).

MLA Style

Lozano, J., et al. “Interdiffusion and Barrier Layer Formation in Thermally Evaporated Mn/Cu Heterostructures on SiO Substrates.” Applied Physics Letters, vol. 98, no. 12, 2011.

Chicago Style

Lozano, J, J Bogan, B Brennan, G Hughes, S Lozano-Perez, P Nellist, and Y Wang. 2011. “Interdiffusion and Barrier Layer Formation in Thermally Evaporated Mn/Cu Heterostructures on SiO Substrates.” Applied Physics Letters 98 (12).
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Publisher copy:: 10.1063/1.3569146

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+ Lozano, J More by this author

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+ Bogan, J More by this author

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+ Brennan, B More by this author

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+ Hughes, G More by this author

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+ Lozano-Perez, S More by this author

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University of Oxford

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MPLS

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Materials

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Bibliographic Details

Journal:: Applied Physics Letters
Volume:: 98
Issue:: 12
Publication date:: 2011-03-21
DOI:: 10.1063/1.3569146
ISSN:: 0003-6951

Item Description

Pubs id:: pubs:179188
UUID:: uuid:62d201fa-7370-4b58-9ea3-ef06aa8c6493
Local pid:: pubs:179188
Source identifiers:: 179188
Deposit date:: 2012-12-19

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Copyright date:: 2011

Licence:: Terms and Conditions of Use for Oxford University Research Archive

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