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Interdiffusion and barrier layer formation in thermally evaporated Mn/Cu heterostructures on SiO substrates

Abstract:

Mn/Cu heterostructures thermally evaporated onto SiO and, subsequently, annealed were investigated by transmission electron microscopy related techniques in order to study the diffusion interactions which lead to barrier layer formation. Energy dispersive x-ray spectroscopy and electron energy loss spectroscopy provide evidence for the interdiffusion between the Mn and Cu layers following a 450°C anneal, where the Mn diffuses toward the surface of the structure, while Cu diffuses toward the M...

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Publisher copy:
10.1063/1.3569146

Authors


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Institution:
University of Oxford
Division:
MPLS
Department:
Materials
Role:
Author
Journal:
Applied Physics Letters More from this journal
Volume:
98
Issue:
12
Publication date:
2011-03-21
DOI:
ISSN:
0003-6951
Pubs id:
pubs:179188
UUID:
uuid:62d201fa-7370-4b58-9ea3-ef06aa8c6493
Local pid:
pubs:179188
Source identifiers:
179188
Deposit date:
2012-12-19

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