Journal article icon

Journal article

Application of high temperature electronics packaging technology to signal conditioning and processing circuits

Abstract:

The requirement to install electronic power and control systems in high temperature environments has posed a challenge to the traditional limit of 125°C for high temperature exposure of electronics systems. The leap in operating temperature to above 200°C in combination with high pressures, vibrations and potentially corrosive environments means that different semiconductors, passives, circuit boards and assembly processes will be needed to fulfil the target performance specifications. Bare d...

Expand abstract

Actions


Authors


More by this author
Institution:
University of Oxford
Division:
MPLS
Department:
Materials
Role:
Author
Expand authors...
Journal:
International Conference and Exhibition on High Temperature Electronics 2010, HiTEC 2010
Pages:
89-96
Publication date:
2010-01-01
Source identifiers:
405712
Language:
English
Keywords:
Pubs id:
pubs:405712
UUID:
uuid:6283347b-684a-47ff-a2f6-1d2bc20c18c9
Local pid:
pubs:405712
Deposit date:
2013-11-17

Terms of use


Views and Downloads






If you are the owner of this record, you can report an update to it here: Report update to this record

TO TOP