Journal article
Application of high temperature electronics packaging technology to signal conditioning and processing circuits
- Abstract:
-
The requirement to install electronic power and control systems in high temperature environments has posed a challenge to the traditional limit of 125°C for high temperature exposure of electronics systems. The leap in operating temperature to above 200°C in combination with high pressures, vibrations and potentially corrosive environments means that different semiconductors, passives, circuit boards and assembly processes will be needed to fulfil the target performance specifications. Bare d...
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Bibliographic Details
- Journal:
- International Conference and Exhibition on High Temperature Electronics 2010, HiTEC 2010
- Pages:
- 89-96
- Publication date:
- 2010-01-01
- Source identifiers:
-
405712
Item Description
- Language:
- English
- Keywords:
- Pubs id:
-
pubs:405712
- UUID:
-
uuid:6283347b-684a-47ff-a2f6-1d2bc20c18c9
- Local pid:
- pubs:405712
- Deposit date:
- 2013-11-17
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- Copyright date:
- 2010
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