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Optimizing the performance of the Au-Si system for high temperature die attach applications

Abstract:

The operation of electronic packages under exceptionally harsh environments presents a significant challenge for the microelectronics industry, for example, in down-hole, well-logging and turbo-machinery applications. High temperature Au based solders are one potential candidate for die attachment for harsh environments and is already used in limited cases. For Au-Si die bonding, some of the Si is provided by diffusion from the Si die itself. Therefore, the interfacial reaction between the Si...

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Institution:
University of Oxford
Division:
MPLS
Department:
Materials
Role:
Author
More by this author
Institution:
University of Oxford
Division:
MPLS
Department:
Materials
Role:
Author
Journal:
Proceedings - 2011 IMAPS International Conference on High Temperature Electronics Network, HiTEN 2011 More from this journal
Pages:
68-76
Publication date:
2011-01-01
Language:
English
Keywords:
Pubs id:
pubs:405709
UUID:
uuid:62516e2a-975c-4bec-838b-6a2c2dfd0620
Local pid:
pubs:405709
Source identifiers:
405709
Deposit date:
2013-11-17

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