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Dissolution and interfacial reaction of Nb in contact with the molten 52In-48Sn solder

Abstract:

The dissolution and interfacial reaction of Nb in contact with the molten 52In-48Sn solder has been investigated in the temperature range 192-260 °C for periods ranging up to 1 year. Intermetallic compounds (IMCs) grow at the interface between the Nb and the solder, after a latency time required for Nb to diffuse in the solder, and these have been identified by X-ray diffraction as NbSn2 hexagonal platelet crystals, with a highly preferred orientation. The crystal sizes have been found to fol...

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Institution:
University of Oxford
Division:
MPLS
Department:
Materials
Role:
Author
More by this author
Institution:
University of Oxford
Division:
MPLS
Department:
Materials
Role:
Author
Journal:
Acta Materialia
Volume:
55
Issue:
15
Pages:
5057-5071
Publication date:
2007-09-01
DOI:
ISSN:
1359-6454
Language:
English
Keywords:
Pubs id:
pubs:178541
UUID:
uuid:61274934-f213-4ebe-89d1-560d8056598c
Local pid:
pubs:178541
Source identifiers:
178541
Deposit date:
2013-11-17

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