Journal article
Dissolution and interfacial reaction of Nb in contact with the molten 52In-48Sn solder
- Abstract:
-
The dissolution and interfacial reaction of Nb in contact with the molten 52In-48Sn solder has been investigated in the temperature range 192-260 °C for periods ranging up to 1 year. Intermetallic compounds (IMCs) grow at the interface between the Nb and the solder, after a latency time required for Nb to diffuse in the solder, and these have been identified by X-ray diffraction as NbSn2 hexagonal platelet crystals, with a highly preferred orientation. The crystal sizes have been found to fol...
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Bibliographic Details
- Journal:
- Acta Materialia
- Volume:
- 55
- Issue:
- 15
- Pages:
- 5057-5071
- Publication date:
- 2007-09-01
- DOI:
- ISSN:
-
1359-6454
Item Description
- Language:
- English
- Keywords:
- Pubs id:
-
pubs:178541
- UUID:
-
uuid:61274934-f213-4ebe-89d1-560d8056598c
- Local pid:
- pubs:178541
- Source identifiers:
-
178541
- Deposit date:
- 2013-11-17
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- Copyright date:
- 2007
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