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Carbon nanotubes for interconnects in VLSI integrated circuits

Abstract:
The paper reviews the requirements for carbon nanotubes to be used as interconnects in VLSI integrated circuits. It describes the production by chemical vapour deposition of high density arrays of nanotubes suitable for use as interconnects, and describes their characterisation by Raman and transmission electron microscopy. © 2008 Wiley-VCH Verlag GmbH and Co. KGaA.

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Publisher copy:
10.1002/pssb.200879553

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Journal:
Physica Status Solidi (B) Basic Research
Volume:
245
Issue:
10
Pages:
2303-2307
Publication date:
2008-10-05
DOI:
EISSN:
1521-3951
ISSN:
0370-1972
URN:
uuid:5970be8b-e05a-46a9-af3a-066e72a330ce
Source identifiers:
178754
Local pid:
pubs:178754

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