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High temperature Au-based solder reliability in electronic packages for harsh environments

Abstract:

The operation of electronic packages in high temperature environments is a significant challenge for the microelectronics industry, and poses a challenge to the traditional temperature limit of 125°C for high electronic systems, such as those used in down-hole, well-logging and aero-engine applications. The present work aims to develop understanding of how and why attach materials for Si dies degrade/fail under harsh environments by investigating high temperature Au based solders. Au-2wt%Si e...

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Institution:
University of Oxford
Department:
Oxford, MPLS, Materials
Role:
Author
More by this author
Institution:
University of Oxford
Department:
Oxford, MPLS, Materials
Role:
Author
Journal:
44th International Symposium on Microelectronics 2011, IMAPS 2011
Volume:
1
Pages:
438-445
Publication date:
2011-01-01
URN:
uuid:47f897af-ee04-4c7c-8264-03af55fffed3
Source identifiers:
415297
Local pid:
pubs:415297

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