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From chip to cooling tower data center modeling: Chip leakage power and its impact on cooling infrastructure energy efficiency

Abstract:

The power consumption of the chip package is known to vary with operating temperature, independently of the workload processing power. This variation is commonly known as chip leakage power, typically accounting for ∼10% of total chip power consumption. The influence of operating temperature on leakage power consumption is a major concern for the IT industry for design optimization where IT system power densities are steadily increasing and leakage power expected to account for up to ∼50% of ...

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Publisher copy:
10.1115/IPACK2011-52030

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Journal:
ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011
Volume:
2
Pages:
433-442
Publication date:
2011-01-01
DOI:
URN:
uuid:3c91fee2-93bc-46d5-999d-e7833f9ff877
Source identifiers:
369441
Local pid:
pubs:369441
Language:
English

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