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Nanomechanical characterization of Sn-Ag-Cu/Cu joints - Part 2: Nanoindentation creep and its relationship with uniaxial creep as a function of temperature

Abstract:

In the first part of this study we reported the use of nanoindentation to evaluate the mechanical properties of microphases formed within Sn-Ag-Cu-based solder joints as a function of temperature. In this second part, the use of nanoindentation has been extended to study the creep behaviour of these phases in the temperature range 25-175 °C. The data for nanoindentation creep has been compared with that reported for bulk creep behaviour of similar alloys. A methodology has been developed base...

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Institution:
University of Oxford
Department:
Oxford, MPLS, Materials
Role:
Author
More by this author
Institution:
University of Oxford
Department:
Oxford, MPLS, Materials
Role:
Author
Journal:
Acta Materialia
Volume:
61
Issue:
7
Pages:
2471-2480
Publication date:
2013-04-05
DOI:
ISSN:
1359-6454
URN:
uuid:3abb6333-66c1-4336-ab7e-3fd555686c51
Source identifiers:
394082
Local pid:
pubs:394082

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