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Fabrication of wafer level chip scale packaging for optoelectronic devices

Abstract:

A novel, simple processing and wafer level packaging method for a 4×4 Resonant Cavity LEDs chip with individual array is under development. Palladium/Gold (Pd/Au) alloys are used as p-type contacts and as rewiring metallization for optoelectronic devices to improve the fabrication process. By use of these alloys we have found a reduction of a factor of 10 in the resistance compared to Titanium/Gold (Ti/Au), due to the formation of a conducting oxide at the interface between the metal and semi...

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Publication status:
Published

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Institution:
University of Oxford
Division:
MPLS
Department:
Engineering Science
Role:
Author
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Institution:
University of Oxford
Division:
MPLS
Department:
Engineering Science
Role:
Author
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Publisher:
IEEE
Pages:
1145-1147
Host title:
49TH ELECTRONIC COMPONENTS and TECHNOLOGY CONFERENCE - 1999 PROCEEDINGS
Publication date:
1999-01-01
ISSN:
0569-5503
Source identifiers:
62774
ISBN:
0780352319
Pubs id:
pubs:62774
UUID:
uuid:39dc876a-669b-4264-9593-fae4bcf7a151
Local pid:
pubs:62774
Deposit date:
2012-12-19

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