Conference icon

Conference

Fabrication of wafer level chip scale packaging for optoelectronic devices

Abstract:

A novel, simple processing and wafer level packaging method for a 4×4 Resonant Cavity LEDs chip with individual array is under development. Palladium/Gold (Pd/Au) alloys are used as p-type contacts and as rewiring metallization for optoelectronic devices to improve the fabrication process. By use of these alloys we have found a reduction of a factor of 10 in the resistance compared to Titanium/Gold (Ti/Au), due to the formation of a conducting oxide at the interface between the metal and semi...

Expand abstract
Publication status:
Published

Actions


Authors


Faulkner, GE More by this author
More by this author
Institution:
University of Oxford
Department:
Oxford, MPLS, Engineering Science
More by this author
Institution:
University of Oxford
Department:
Oxford, MPLS, Engineering Science
Expand authors...
Publisher:
IEEE
Pages:
1145-1147
Publication date:
1999
ISSN:
0569-5503
URN:
uuid:39dc876a-669b-4264-9593-fae4bcf7a151
Source identifiers:
62774
Local pid:
pubs:62774
ISBN:
0-7803-5231-9

Terms of use


Metrics



If you are the owner of this record, you can report an update to it here: Report update to this record

TO TOP