Journal article
Mapping type III intragranular residual stress distributions in deformed copper polycrystals
- Abstract:
-
Cross-correlation-based analysis of electron backscatter diffraction patterns has been used to map the intragranular residual stress variations in polycrystalline copper samples deformed to different plastic strain levels of 0%, 2%, 6% and 10%. We map the deviation from the mean stress within each grain and present histograms of stress levels mapped over many grains which show a central Gaussian-like peak with non-Gaussian tails at the higher stress magnitudes. The width of the peaks increase...
Expand abstract
- Publication status:
- Published
Actions
Authors
Bibliographic Details
- Journal:
- ACTA MATERIALIA
- Volume:
- 61
- Issue:
- 15
- Pages:
- 5895-5904
- Publication date:
- 2013-09-01
- DOI:
- ISSN:
-
1359-6454
Item Description
- Keywords:
- Pubs id:
-
pubs:415438
- UUID:
-
uuid:328f7e3f-9a0f-41a7-998f-db384f122c16
- Local pid:
- pubs:415438
- Source identifiers:
-
415438
- Deposit date:
- 2013-11-17
Terms of use
- Copyright date:
- 2013
Metrics
If you are the owner of this record, you can report an update to it here: Report update to this record