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Mapping type III intragranular residual stress distributions in deformed copper polycrystals

Abstract:

Cross-correlation-based analysis of electron backscatter diffraction patterns has been used to map the intragranular residual stress variations in polycrystalline copper samples deformed to different plastic strain levels of 0%, 2%, 6% and 10%. We map the deviation from the mean stress within each grain and present histograms of stress levels mapped over many grains which show a central Gaussian-like peak with non-Gaussian tails at the higher stress magnitudes. The width of the peaks increase...

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Publication status:
Published

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Journal:
ACTA MATERIALIA
Volume:
61
Issue:
15
Pages:
5895-5904
Publication date:
2013-09-05
DOI:
ISSN:
1359-6454
URN:
uuid:328f7e3f-9a0f-41a7-998f-db384f122c16
Source identifiers:
415438
Local pid:
pubs:415438

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