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A New Methodology For In-Situ Residual Stress Measurement In MEMS Structures

Abstract:

In this paper, a new approach is presented for local residual stress measurement in MEMS structures. The newly proposed approach involves incremental focused ion beam (FIB) milling of annular trenches at material surface, combined with high resolution SEM imaging and Digital Image Correlation (DIC) analysis for the measurement of the strain relief over the surface of the remaining central pillar. The proposed technique allows investigating the average residual stress on suspended micro-struct...

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Publication status:
Published

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Publisher copy:
10.1063/1.3527116

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Institution:
University of Oxford
Department:
Oxford, MPLS, Engineering Science
Role:
Author
Volume:
1300
Pages:
120-126
Publication date:
2010-01-01
DOI:
EISSN:
1551-7616
ISSN:
0094-243X
URN:
uuid:21e2c4a4-fcc3-4538-8495-59af2a081d2d
Source identifiers:
124476
Local pid:
pubs:124476
ISBN:
978-0-7354-0855-5

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