A 100GB/s wide I/O with 4096b TSVs through an active silicon interposer with in-place waveform capturing (Digest of Technical Papers - IEEE International Solid-State Circuits Conference, 2013)

(untitled) - Takaya, S; Nagata, M; Sakai, A; Kariya, T; Uchiyama, S; Kobayashi, H; Ikeda, H