Journal article

Nanomechanical characterization of Sn-Ag-Cu/Cu joints-Part 2: Nanoindentation creep and its relationship with uniaxial creep as a function of temperature

Publication status:: Published

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APA Style

Marques, V., Wunderle, B., Johnston, C., & Grant, P. (2013). Nanomechanical characterization of Sn-Ag-Cu/Cu joints-Part 2: Nanoindentation creep and its relationship with uniaxial creep as a function of temperature. ACTA MATERIALIA, 61(7), 2471–2480.

MLA Style

Marques, V, et al. “Nanomechanical Characterization of Sn-Ag-Cu/Cu Joints-Part 2: Nanoindentation Creep and Its Relationship with Uniaxial Creep as a Function of Temperature.” ACTA MATERIALIA, vol. 61, no. 7, 2013, pp. 2471–80.

Chicago Style

Marques, V, B Wunderle, C Johnston, and P Grant. 2013. “Nanomechanical Characterization of Sn-Ag-Cu/Cu Joints-Part 2: Nanoindentation Creep and Its Relationship with Uniaxial Creep as a Function of Temperature.” ACTA MATERIALIA 61 (7): 2471–80.
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Publisher copy:: 10.1016/j.actamat.2013.01.020

Authors

+ Marques, V More by this author

Role:: Author

+ Wunderle, B More by this author

Role:: Author

+ Johnston, C More by this author

Institution:: University of Oxford
Division:: MPLS
Department:: Materials
Role:: Author

+ Grant, P More by this author

Institution:: University of Oxford
Division:: MPLS
Department:: Materials
Role:: Author

Journal:: ACTA MATERIALIA More from this journal
Volume:: 61
Issue:: 7
Pages:: 2471-2480
Publication date:: 2013-04-01
DOI:: 10.1016/j.actamat.2013.01.020
ISSN:: 1359-6454

Keywords:: Intermetallics

Reliability

High-temperature nanoindentation

Lead-free solders

Aerospace applications
Pubs id:: pubs:384726
UUID:: uuid:013fd2ff-0504-4a36-b4f2-bea0078a6aaa
Local pid:: pubs:384726
Source identifiers:: 384726
Deposit date:: 2013-11-17
ARK identifier:: ark:/29072/ora_013fd2ff05044a36b4f2bea0078a6aaa

Terms of use

Copyright date:: 2013

Licence:: Terms and Conditions of Use for Oxford University Research Archive

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